Aerogel is a man-made material with the lowest dielectric and lowest dielectric loss, and is the main low-dielectric application material for 5G in the future. The porosity of silicon-based aerogel developed by our company is greater than 70%, the density is about 0.1~0.13g/cm3, and the dielectric coefficient is close to 1.5. The porosity of PI/Silica Aerogel and Epoxy/Silica Aerogel are both greater than 60%, the density is about 0.25~0.30 g/cm3, and the dielectric coefficient is close to 2.0. At the same time, it develops materials with high strength, high surface thermal conductivity, and low dielectric material for surface electromagnetic wave absorption.
